关键模式层（≥65纳米）：高分辨率和噪音抑制技术，产生敏感的关键图案的缺陷，包括：光刻CD的变化和缺少联系;门蚀刻桁;STI空隙;和铜CMP的腐蚀。
之后，制定检查（ADI）：2367最小化进程引起的噪声对产品晶圆照片，使产量限制的缺陷，如中毒光阻，微桥，抵制气泡，检测。
PWQ：工艺窗口资格（PWQ）的应用标识印刷光罩设计错误，使平版有资格为他们设计的工艺窗口在生产之前。
Applications
CriticalPatternLayers(≥65nm):Highresolutionandnoise-suppressiontechnologiesproducesensitivitytocriticalpatterningdefects,including:lithographyCDvariationsandmissingcontacts;gateetchstringers;STIvoids;andcopperCMPcorrosion.
PhotoCellMonitoring(PCM):Usingthe2367withoptimizedtestwafers,PCMaccelerateslearningonlithographyprocesses,helpingfabstorapidlyidentifyandeliminatelithography-relatedmicrodefectsbeforecommittingproductwafers.
After-DevelopInspection(ADI):The2367minimizesprocess-inducednoiseonphotoproductwafers,enablingthedetectionofyield-limitingdefects,suchaspoisonedphotoresists,micro-bridges,andresistbubbles.
PWQ:TheProcessWindowQualification(PWQ)applicationidentifiesprintedreticledesignerrors,enablinglithographerstoqualifytheprocesswindowfortheirdesignspriortoproduction.
Macroafter-developinspection,ormacroADI,hastraditionallybeenamanual,operator-intensiveprocesssincemorethanthree-quartersofyield-relevantdefecttypesarefairlylargeandcanbeseenbythehumaneye.Unfortunately,manualmacroADIhasanumberofseverelimitations:Defectdetectionandclassificationisinconsistentandunreliable,withresultsvaryingsignificantlybetweenoperatorsduetowafercomplexity,inappropriatesampling,noisefrombackgroundpatterning,andoperatorboredomandfatigue.
在AITII是业界第一个150至300毫米晶圆检测系统能够图案提供的吞吐量，灵敏度和低成本的拥有快速，准确的反馈过程工具的性能要求。该AITII还提供了一个自动缺陷分类和分析的综合解决方案，迅速变成良率提高信息缺陷数据。
二是在美国在台协会旨在满足为电影，蚀刻，照片，和CMP应用的灵活性，图案的过程中刀具监控的需求。
TheAITIIisdesignedtomeetthedemandsofpatternedprocesstoolmonitoringwithflexibilityforfilms,etch,photo,andCMPapplications.
2800系列是新一代宽带DUV/UV/VIS图案晶圆亚65纳米设计规则的开发和生产检测平台。凭借其多波长，最终的灵敏度和可扩展性，2800系列可对所有过程层范围最广的缺陷捕获。
复杂的应用程序正如在23XX明检查家庭的姊妹工具，2800系列是适合于独特的应用，可以加速良率学习，并最终屈服。
综合缺陷检测组合2800系列明场检测系列补充彪马9000系列新一代暗视野的平台。加上我们eS3x电子束检查（EBI）系统，这些工具方便全面的缺陷检测策略，使工厂捕捉毫不妥协的所有层的所有缺陷。
The2800Seriesisthenext-generationbroadbandDUV/UV/VISpatternedwaferinspectionplatformforsub-65-nmdesignruledevelopmentandproduction.Withitsmultiplewavelengths,ultimatesensitivity,andextendibility,the2800Seriesenablesthewidest-rangingdefectcaptureforallprocesslayers.
SophisticatedApplicationsAswithitssistertoolsinthe23XXbrightfieldinspectionfamily,the2800Seriesissuitedforuniqueapplicationsthatcanaccelerateyieldlearningand,ultimately,yield.
ComprehensiveDefectInspectionPortfolioThe2800SeriesbrightfieldinspectionfamilycomplementsthePuma9000Seriesnext-generationdarkfieldplatform.TogetherwithoureS3xelectron-beaminspection(EBI)system,thesetoolsfacilitateacomprehensivedefectinspectionstrategythatenablesfabstocapturealldefectsonalllayers,withoutcompromise.
TheKLA-Tencor300UVSerieswasthefirstreticleinspectionfamilyusingUVilluminationfortheinspectionofDUVreticles.WiththehigherresolutionUVwavelengthandnewdefectdetectiontechnology,the300UVreticleinspectionsystemscaninspectreticleswithadvanceddesignrules,criticalOPCstructures,andmanyphaseshifttypes,allcommonelementsofadvancedintegratedcircuittechnology.
The23xxseries,theAITseries,andtheeS30formpartofaKLA-Tencorstrategythatcombinesinspectiontechnologiesthattraditionallywereisolated,suchasbrightfield/darkfieldande-beam.Thiscombinationoffersfabsanew,customizedstrategyforcapturingandcontrollingdefects.
Anoveralldefect-controlsolutiontoaccelerateyieldCapturingdefectsisonlythefirstpartofdefectcontrol.Anothercriticalcomponentistheabilitytoidentifysourcesofdefectsquicklysotheproblemwiththeprocessorequipmentcanberesolvedwithminimumyieldimpact.Thisrequiresefficientandeffectivedefectreview,classification,andanalysis.KLA-Tencordeliversanoverallsolutionthroughthemostcomprehensiverangeofdefectreductionandcontroltechnologyavailable.Thisincludesopticalande-beaminspectionsystems;aUVreticleinspectionsystemthatensurescaptureofalldefecttypes;automateddefectreviewandclassificationsystems;anddataanalysisproductsthatmanage,correlate,andintegratethewealthofdefectdataandimagesfromtheseandothertools.
在2139还可以提供一个集成的SMIF微环境，降低整体晶圆厂洁净度要求，同时流衬自动化。有关完整信息，下载产品概述如下。
The2139waferinspectionsystemprovidesthesensitivityenhancementsandproductivityimprovementsICmanufacturersneedtomeettherequirementsofacceleratedramps,reducedcapitalexpendituresandfastercycletimes.
The2139isalsoavailablewithanintegratedSMIFmini-environment,reducingoverallfabcleanlinessrequirementswhilestream-liningautomation.Forcompleteinformation,downloadtheproductoverviewbelow.
The235xutilizesbroadbandultraviolet(UV)/visibleilluminationandadvancednoisesuppressiontechnologytoprovidetheresolutionandsensitivityrequiredtodetectcriticaldefectsat0.13μmand0.10μmdesignrules.ThissystemfeaturesnewFullSkyTMandEdgeContrastTMmodes.Thesemodesdeliverincreaseddefectsensitivityonfrontendofline(FEOL)layersandbetternoisesuppressiononbackendofline(BEOL)layers.The235xiscapableofinspecting200mmor300mmpatternedwafers,andprovideshigherthroughputthanitspredecessors.Withtheadditionofin-lineautomaticdefectclassification(iADC)andPMC-NetTMintegrateddataanalysiscapabilities,the235xprovidesfastandconsistentclassificationandidentificationofyield-limitingdefects.
直接测量的折射率和在电影片叠消光系数，并拟合测量了薄膜的质量，提高生产力和更严格的每一步计量过程控制结果间接善良。
Tomeetdemandingproductivityrequirements,thePrometrix?UV-1250SEThinFilmMeasurementSystemisasingle-solutiontoolthatcanindependentlyandsimultaneouslymeasurefilmthickness,refractiveindex,extinctioncoefficient,andgoodness-of-fitofsingle-layerormulti-layerthinfilmstacks.
Directmeasurementoftherefractiveindexandtheextinctioncoefficientoffilmsinafilmstack,andindirectgoodnessoffitmeasurementsofthefilmquality,resultsingreaterproductivitypermetrologystepandtighterprocesscontrol.
ThePrometrixUV-1250SEThinFilmMeasurementsystemcombinesthepowerofspectroscopicellipsometryandthefunctionalityofbroadbandUVspectrophotometryinaproduction-worthyplatform.Longconsideredbyscientiststobetheultimatetechniquefornon-destructiveopticalcharacterization,spectroscopicellipsometry(SE)hasfoundwidespreaduseinresearchanddevelopment.
TheKLA2135isawaferinspectionsystemthatincorporatesadvancedsensorandimageprocessingtechnologies.The2135enablesmanufacturerstodetectalltypesofyield-relevantdefectsonallprocesslayers,withhighcapturerates,automaticallyandconsistently.Withatwo-tothree-timesthroughputimprovementovertheearliermodelKLA2132,theKLA2135deliversunmatchedspeedandsensitivityforin-linemonitoringofadvancedprocesses.
TheKLA2135consistentlydetectsthewidestrangeofyield-relevantdefects,atallprocesslayers,andatthespeedsrequiredforhigh-volumewaferproduction.
在2138还可以提供一个集成的SMIFminienvironment，降低整体晶圆厂洁净度要求，同时简化自动化。有关完整信息，下载产品概述如下。
The2138isalsoavailablewithanintegratedSMIFminienvironment,reducingoverallfabcleanlinessrequirementswhilestreamliningautomation.Forcompleteinformation,downloadtheproductoverviewbelow.
2139是还可以提供一个集成的SMIF微环境，降低整体晶圆厂洁净度要求而流衬自动化。有关完整信息，下载产品概述如下。